Power Module Packaging Market Top Leading Players with Research Data 2032 | Emergen Research

 The latest market intelligence report, titled ‘Global Power Module Packaging Market ’, is intended to provide the target audience with the necessary information about the global Power Module Packaging Market  industry. The report comprises a detailed analysis of the vital elements of the Power Module Packaging Market  , including key drivers, constraints, opportunities, limitations, threats, and micro- and macro-economic factors. The report carefully investigates the present market scenario and the fundamental growth prospects

The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.

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Exhaustive coverage of the COVID-19 impact on the Power Module Packaging Market   industry is a major attraction of the report. The global health emergency has beleaguered the global economy, thereby disrupting this particular business domain’s functioning mechanism. It assesses the present market scenario and forecasts the pandemic’s aftermath in this business sector to help organizations boost their COVID-19 preparedness.

Research Report on the Power Module Packaging Market Addresses the Following Key Questions:

  • Who are the dominant players of the Power Module Packaging market?
  • Which regional market is anticipated to have a high growth rate over the projected period?
  • What consumer trends and demands are expected to influence the operations of the market players in the Power Module Packaging market?
  • What are the key growth drivers and restraining factors of the Power Module Packaging market?
  • What are the expansion plans and strategic investment plans undertaken by the players to gain a robust footing in the market?
  • What is the overall impact of the COVID-19 pandemic on the Power Module Packaging market and its key segments?

Global Power Module Packaging Market: Competitive Analysis :

SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc

The research study examines historic data from 2018 and 2020 to draw forecasts until 2032. The timeline makes the report an invaluable resource for readers, investors, and stakeholders looking for key insights in readily accessible documents with the information presented in the form of tables, charts, and graphs.

Valuable Market Insights:

  • The report highlights the latest trends observed in the consumption pattern of each regional segment.
  • Extensive market segmentation included in the report helps better understand the revenue and estimated growth of the individual regions.
  • The report throws light on the historical and current market scenarios and provides a concise year-on-year growth rate of the global Power Module Packaging Market .
  • The report further entails the current market trends, technological advancements, revenue growth, and other aspects affecting market growth.

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Segments Covered in this report are:

  • Power Module Type Outlook (Revenue, USD Billion; 2019-2032)

    • Silicon Carbide (SiC) Module
    • Gallium Nitride (GaN) Module
    • Insulated-Gate Bipolar Transistor (IGBT) Module
    • Field-Effect Transistor (FET) Module
    • Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
    • Others

  • Technology Outlook (Revenue, USD Billion; 2019-2032)

    • Standard Packaging
    • Advanced Packaging
    • Pressure-Contact Modules
    • Others

  • Thermal type Outlook (Revenue, USD Billion; 2019-2032)

    • Liquid-Cooled
    • Air-Cooled
    • Hybrid

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Regional Segmentation;

North America (U.S., Canada)

Europe (U.K., Italy, Germany, France, Rest of EU)

Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)

Latin America (Chile, Brazil, Argentina, Rest of Latin America)

Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)

The report considers the following timeline for market estimation:

  • Historical Years: 2017-2018
  • Base Year: 2019
  • Estimated Year: 2027
  • Forecast Years: 2023-2032

TOC of the global Power Module Packaging Market report:

  • Chapter 1, describes the Power Module Packaging Market Introduction, market overview, product offerings, growth opportunities, market risks, driving forces, and challenges.
  • Chapter 2, analyzes the key manufacturers of Power Module Packaging Market , along with the sales, revenue, and price of Power Module Packaging Market , in the forecast period.
  • Chapter 3, studies the competitive situation among the major manufacturers and vendors, with sales, revenue, and market share.
  • Chapter 4, analyzes the global market by regions, with sales, revenue, and market share of Power Module Packaging Market, for each region, from 2020 to 2032.
  • Chapters 5, 6, 7, 8 and 9, analyze the Power Module Packaging Market by type, application, regions, and manufacturers, with sales, revenue, and market share by key countries in these regions…Continued

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